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ISC 2025 Recap: ESOPTIC’s Commitment to High-Performance Interconnects and a Sustainable HPC Future

2025-06-17

Introduction: The Energy Behind the Speed

As the digital world accelerates toward AI dominance, edge computing, and exascale systems, the annual ISC 2025 exhibition in Hamburg, Germany, emerged once again as a cornerstone event for the global high-performance computing (HPC) industry.

At ISC 2025, thousands of professionals, researchers, and enterprises gathered to explore the next evolution in supercomputing and data center technology. For ESOPTIC, a leader in optical communication solutions, this event was a powerful opportunity to present our latest advances — and most importantly, to engage in meaningful conversations about the future of HPC.

ISC 2025


Why ISC 2025 Mattered for the Optical Communication Industry

The theme of ISC 2025 — “Revolutionizing HPC for a Sustainable Future” — perfectly aligned with the direction in which we’ve been steering our product innovation. As AI workloads demand exponentially faster interconnect speeds and better thermal performance, the role of optical modules and high-density cabling becomes more central than ever.

ISC 2025 was more than just a trade show; it was a convergence of ideas, where next-generation challenges were met with real-world solutions. For optical communication vendors like ESOPTIC, the event allowed us to:

  • Understand the HPC community’s emerging needs

  • Demonstrate live performance of high-speed transceivers

  • Position our green initiatives alongside other major players

  • Build new technical and commercial partnerships

  • AI/ML


What We Showcased at ISC 2025

At booth A44, ESOPTIC presented a curated lineup of solutions engineered for high-throughput, low-latency, and sustainable performance. These included:

1. 800G Optical Transceivers

Our 800G QSFP-DD and OSFP transceivers took center stage, addressing the bandwidth explosion driven by AI clusters and exascale systems. Visitors to our booth were particularly drawn to our LPO (Linear Pluggable Optics) solutions, which eliminate the DSP chip to reduce power consumption and latency.

2. Active Optical Cables (AOC) & Direct Attach Cables (DAC)

From 100G to 800G, our AOC and DAC offerings support plug-and-play interconnects across rack-to-rack and server-to-switch applications. With enhanced shielding and custom lengths, they provide flexible yet reliable deployment in hyperscale environments.

3. High-Speed Passive Copper Solutions

For HPC centers looking to reduce power draw while maintaining low BER (Bit Error Rate), our passive copper DACs are still an unbeatable option. Several R&D engineers at ISC 2025 expressed interest in our customized low-loss copper assemblies.

4. Compatibility & Green Compliance

As a provider of MSA-compliant and OEM-compatible optical modules, ESOPTIC emphasized our commitment to seamless integration and energy-efficient design. All showcased products conform to RoHS/REACH standards and undergo 100% functionality testing before shipment.

SFP+

Highlights from ISC 2025

Over three days, ISC 2025 hosted more than 3,000 attendees and 150 exhibitors. ESOPTIC’s team held technical discussions with system architects, purchasing managers, and CTOs from data centers, cloud computing firms, and research institutions.

Some of the most exciting moments for us included:

  • Live Demo Sessions: Demonstrating 800G DACs and LPO modules running in high-density racks under simulated HPC workloads.

  • Green Interconnect Panel: Our representative participated in an expert panel focused on energy-saving strategies for future data centers, bringing attention to lightweight LPO and AOC technologies.

  • New Partnership Talks: Initial dialogues with European cloud providers about deploying ESOPTIC’s 400G and 800G series in test labs.

  • Booth Interaction: Visitors praised our clear visual displays and technical clarity. Our onsite team answered dozens of inquiries regarding product roadmaps, transceiver longevity, and thermal management strategies.


Key Takeaways from ISC 2025

As the HPC industry enters a transformative phase, several key trends became evident at ISC 2025:

? AI Workloads Are Reshaping Interconnect Needs

Neural networks require faster intra-node and inter-node communication, propelling demand for 800G and beyond.

? Power Efficiency Is Now a Competitive Edge

Reducing watts per gigabit isn’t just a green initiative — it’s now a financial and operational necessity for data centers.

? Open Standards and Compatibility Matter

MSA-compliant modules and interoperability with major switch vendors are high-priority criteria for buyers.

? Optical + Copper Hybrid Deployments Are Growing

More data centers are mixing AOCs with passive DACs to balance cost, performance, and thermal footprint.

ISC 2025

ESOPTIC’s Commitment Beyond ISC 2025

Although ISC 2025 has ended, our mission continues. The demand for sustainable, high-speed interconnects is not a trend — it’s a foundational requirement for future data centers and supercomputing hubs.

ESOPTIC will continue to invest in:

  • R&D for next-gen 1.6T and co-packaged optics

  • Optimizing LPO modules for AI/ML clusters

  • Developing greener packaging and lower carbon logistics

  • Enhanced technical support and on-site compatibility testing

We’re also planning to participate in other major tech exhibitions in the second half of 2025, bringing updated product lines and case studies to an even broader audience.


Thank You for Joining Us at ISC 2025

To all our partners, customers, and visitors — thank you for making ISC 2025 an unforgettable experience for ESOPTIC. We’re grateful for the thoughtful conversations, technical feedback, and enthusiasm shared throughout the event.

If you missed us at booth A44, you can still learn more about our featured solutions by visiting www.qdgjzx.cn or contacting our team directly for product datasheets, custom quotations, or partnership discussions.

Let’s continue the conversation — and keep building the future of high-performance computing together.

AI/ML

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